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GEMStar-4 XT ™

Arradiance

GEMStar-4 XT ™ The GEMStar XT platform is the next generation of the popular GEMStar line of full-feature, benchtop Atomic Layer Deposition Systems.

A small, rugged, lightweight machine for heavyweight R&D efforts, GEMStar XT makes optimal use of lab space and research budgets.

The GEMStar-4 XT Thermal Atomic Layer Deposition system, although entry level, offers 300 °C thermal Atomic Layer Deposition (ALD) processing of 100 mm dia (4 inch wafers) and, 100 mm SQ., or 150 mm x 100 mm rectangular substrates 25 mm thick.

Although GEMStar-4 XT is equipped with a single 200 °C manifold zone, the system comes equipped with four high speed c-seal material ALD valve ports, two locatable 175° C material temperature zones. One standard port allows Pulsed Vapor Push technology controlled by an additional high speed c-seal ALD valve offering a solution for low vapor pressure materials.
  • Specifications
  • Applications
  • Heated Chuck
  • Pulse CVD
  • Glovebox Interface
  • Ozone Generator
  • Exhaust Abatement
  • Particle Coater
  • Product Matrix
  • PDFs

The system accommodates substrates 100 mm diameter as standard. Door mounted end effectors are available for batch, 100 mm SQ., and 100 mm X 150 mm on request.

Distributed gas delivery insures uniform gas distribution over the entire substrate

KF 50 Vacuum interface for high speed requirements

All metal seal gas handling

MFC controlled user selectable gas input up to 200 SCCM

A KF 40 metrology interface allowing easy addition of QCM or other devices

Touch safe exterior including USB controller with watchdog protection and EMO interface

 

Door Mounted Substrate End Effector

100 mm (4”) Dia. / 100 mm Square Standard 100 mm x 150 mm optional

Batch x 5 100 mm dia. optional

System Dimensions

11” H x 32” W x 24” D designed to fit on desktop or lab bench

Reactor/Door Thermal Zones

1250 W reactor zone up to 300 °C ± 1 °C

250 W door zone up to 300 °C ± 1 °C

Air Cooled

Material Manifold

Single 200 °C Zone

4 High Speed ALD Valve Controlled Material Ports

Single Vapor Push Zone controlled by High Speed ALD Valve

Material Bottle Heated Zones

Two 200 °C movable insulated material zones

Material Bottles

Three DOT certified 150 ML Bottles with bellows sealed ON/OFF valves

VCR-4 Connection

External Gas Input

Single VCR-4 Input for external gasses such as available Ozone option

Inert Carrier Gas

Mass Flow Controlled up to 200 SCCM

Control System

GEMFlowTM Control Software

Laptop Dell Mobile Precision M2800 CTO, Windows 7 Professional, 64-bit

GEMStar XT USB control module

Metrology Port

Spare KF-40 In Line metrology port for QCM or other customer needs

 

 

Semiconductors

High-k Gate Dielectrics (e.g. HfO2, ZrO2)

Conductive Gate Electrodes

Diffusion Barriers (e.g. TiN, TaN)

Adhesion/Seed Layers

 

Optoelectronics

OLEDs – devices, coatings

Electroluminescence

Transparent conductive oxides

Display Backlighting

Optical components – waveguides, filters

 

Micro Electro-Mechanical Systems (MEMS)

Sensors

 

Energy Conversion and Storage

Solar Cells – devices, passivation

Fuel Cells, Batteries

Supercapacitors

 

Chemical Processes

Catalysis – particles

Fuels – particles

 

Biological Applications

Micro/Nano Fluidics for DNA sequencing, virus detection

Biosensors – bio-compatible barrier coatings

Pharmaceuticals packaging

 

Industrial Coatings – 3D Objects

500 °C Heated Chuck Option

Allows up to 500 °C hot plate operation while heating the chamber walls up to 300 °C.

Plug-compatible door module allows easy swap with standard 300 °C hot wall operation.

Stainless steel heater design with retained 6" aluminum chuck to achieve temperature uniformity of substrate.

All external temperature safety standards maintained with the option.

Pulsed CVD Option

Fully controlled through the system software for maximum flexibility of use in complex recipes. Two separately controlled MFC channels for CVD gases. Manifold valves support continuous flow

Glovebox Interface Option

Space in the glovebox: The access port for the swing-out door of GEMStar built into the back or side of the glovebox maximizes the usable workspace inside. No space is taken up in the middle of the glovebox by a large chamber.

Ease and Safety of Loading/Unloading: The substrate holder swinging out with the sidemounted door of GEMStar makes it easy and safe to load/unload substrates with minimal exposure to the chamber and minimal particle introduction.

Heat management: In GEMStar, most of the chamber heat is outside of the glove box, unlike vertical chambers which add significant heat load inside the glovebox which has to be actively managed.

Access to precursors and maintenance: GEMStar mounted on the back or side of a glovebox retains its easy, waist-high access forprecursor changeover and maintenance, unlike vertical chambers mounted under the glovebox with challenging access for maintenance.

Ozone Generator Option

Ozone is a stronger oxidizer than water and allows lower temperature ALD oxide depositions on temperature sensitive polymer substrates. With its higher reactivity, Ozone allows a broader range of precursor chemistries.

Ozone can also be used for in-situ cleans. Ozone is generated on-site from an O2 discharge, with continuous flow to the exhaust through an ozone destruct. The Ozone is connected to a process gas port on the back of GEMStar.

Ozone dose is controlled through an ALD valve on the oxidizer manifold with GEMFlowTM software.

Exhaust Abatement Option

The in-line furnace is typically operated at 700 °C which can break down most commonly used metalorganic precursors. It is capable of reaching temperatures up to 1100 °C.

The oxide or metal particles generated in the furnace are captured in a metal-mesh particle trap and prevented from reaching the pump.

Particle Coater Option

The GEMStar chamber size can accommodate up to 8” (200mm) diameter wafers, or 3D objects up to 1.3” (33mm) tall, or powders. Up to 300 °C hot-wall design with convective heating can achieve ±1C temperature uniformity in 3-dimensional space thus enabling conformal depositions over powders.

Exposure control is critical for conformal ALD films on high aspect ratio structures. Partial pressure and residence times are precisely controlled with a downstream vacuum valve.

Specially designed particle holder can be conveniently connected to GEMStar through the KF40 metrology port. Quick disconnect particle canister facilitates loading and unloading of particles. Customizable screen filter on particle canister. Seal-less magnetic drive for continuous rotation with user settable RPMs to facilitate conformal coatings around the particles.

Benchtop ALD Systems

Cost effective solutions that address the Atomic Layer Deposition (ALD) research community’s and low volume manufacturing’s current and future needs over a broad range of substrates and sample sizes.