Thermal Cantilevers
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Thermal Cantilevers

Heidelberg Instruments Nano

The thermal cantilevers are the core of the NanoFrazor, with their technology originating from the IBM Millipede project. The probes feature a heatable tip, a fast and precise electrostatic actuation mechanism allowing for 3D patterning, and an integrated topography sensor for in-situ metrology. Currently we provide High Power Cantilevers for use in the NanoFrazor Explore. Additional cantilever designs are in development in collaboration with several partners. They will enable patterning on non-conductive substrates and enhance performance through the use of tip arrays.
High Power Cantilever
  • Based on IBM Millipede technology
    Ultra-sharp silicon tips
    Two integrated micro-heaters (topography sensor & tip heater)
    Topography sensor to measure the distance to the surface with sub-nm resolution via the heat exchange through the air
    Fast and accurate electrostatic actuation via the workpiece
    Fabrication on full wafers keeps the costs per cantilever low
    Easy manual cantilever exchange without additional tools
Backside Electrode Cantilever
  • Same material as High Power Cantilever
    Enables patterning on electrically isolating substrates
    No contacting of workpiece needed


Tip radius

< 10 nm

Tip height

700 nm

Spring constant

0.25 N/m

Resonance frequency

100 kHz

Microheaters size

4 µm x 2 µm x 0.4 µm

Microheaters temperature range

20° - 1000 °C

Microheaters thermal time constant

6 µs

Topography sensor resolution

0.1 nm

Topography sensor bandwidth

150 kHz

Exchange and calibration of cantilevers

< 1 minute



Sieve Plate: Similar to a Fresnel zone plate, a photon sieve focuses light, for focusing of X-rays, astronomical applications to superfocusing with a spatial resolutions beyond the diffraction limit. (design of the sieve plate courtesy of Adam Jeff, CERN)