get a quote



GEMStar-8 XT PEALD ™ The GEMStar XT platform is the next generation of the popular GEMStar line of full-feature, benchtop Atomic Layer Deposition Systems
A small, rugged, lightweight machine for heavyweight R&D efforts, GEMStar XT makes optimal use of lab space and research budgets.

The GEMStar-8 XT PEALD Plasma Enhanced Atomic Layer Deposition system offers our greatest flexibility for both processing and substrate size including 300 °C (500 °C optional) PEALD and Atomic Layer Deposition (ALD) processing of up to 200 mm dia (8 inch wafers) in a single system.

GEMStar-8 XT PEALD is equipped with a 300 Watt air cooled direct Inductively Coupled Plasma (ICP) system with four metal sealed mass flow controlled gas inputs, dual 200 °C manifold zones and eight high speed c-seal material ALD valve ports, two locatable 175 °C material temperature zones. One standard port allows Pulsed Vapor Push technology controlled by an additional high speed c-seal ALD valve offering a solution for low vapor pressure materials.

After many years of internal system, process, research and testing we offer the only Benchtop PEALD and Thermal ALD system for your material development critical to your needs. Do not be fooled by other’s claims.
get a quote
  • Specifications
  • Applications
  • Heated Chuck
  • Pulse CVD
  • Glovebox Interface
  • Ozone Generator
  • Exhaust Abatement
  • Particle Coater
  • Product Matrix
  • PDFs

The system accommodates substrates 200 mm diameter as standard. Door mounted end effectors are available for batch (Process Dependent) or other requirement on request

300 Watt Air Cooled Direct ICP Head with four metal sealed mass flow controlled plasma gas inputs

Dual 200 °C manifold distributed gas delivery insures uniform gas distribution over the entire substrate and provides eight high speed ALD ports with dual (up to four optional) external gas connection ports

Four 175 °C material bottle temperature zones

Six DOT certified 150 ML Bottles with bellows sealed ON/OFF valves

KF 50 Vacuum interface for high speed requirements

All metal seal gas handling


Door Mounted Substrate End Effector

200 mm (8”) Dia. Standard

Other sizes available on request

System Dimensions

11” H x 32” W x 24” D designed to fit on desktop or lab bench

Reactor/Door Thermal Zones

1250 W reactor zone up to 300 °C ± 1 °C

250 W door zone up to 300 °C ± 1 °C

500 °C Processing available on request

Material Manifold

Dual 200 °C manifold zones

8 High Speed ALD Valve Controlled Material Ports

Single Vapor Push Zone controlled by High Speed ALD Valve

Plasma Source

Power controllable with automatic tuning 300 W Direct ICP Air Cooled Head with easy access to four mass flow controlled plasma gas inputs with user selectable bellows sealed (ON/OFF) valves

Material Bottle Heated Zones

Four 175 °C movable insulated material zones

Material Bottles

Six DOT certified 150 ML Bottles with bellows sealed ON/OFF valves

VCR-4 Connection

External Gas Input

Dual VCR-4 Input for external gasses such as available Ozone option

Up four available on request

Four VCR-4 Input for external Plasma gas inputs

Inert Carrier Gas

Mass Flow Controlled up to 200 SCCM. System couples carrier gas to first plasma gas input

Control System

GEMFlowTM Control Software

Laptop Dell Mobile Precision M2800 CTO, Windows 7 Professional, 64-bit

GEMStar XT USB control module

Half Rack

11” H x 12” W x 21” D locatable designed to fit on desktop or lab bench

With RF Power Supply

Metrology Port

Spare KF-40 In Line metrology port for QCM or other customer needs



High-k Gate Dielectrics (e.g. HfO2, ZrO2)

Conductive Gate Electrodes

Diffusion Barriers (e.g. TiN, TaN)

Adhesion/Seed Layers



OLEDs – devices, coatings


Transparent conductive oxides

Display Backlighting

Optical components – waveguides, filters


Micro Electro-Mechanical Systems (MEMS)



Energy Conversion and Storage

Solar Cells – devices, passivation

Fuel Cells, Batteries



Chemical Processes

Catalysis – particles

Fuels – particles


Biological Applications

Micro/Nano Fluidics for DNA sequencing, virus detection

Biosensors – bio-compatible barrier coatings

Pharmaceuticals packaging


Industrial Coatings – 3D Objects

500 °C Heated Chuck Option

Allows up to 500 °C hot plate operation while heating the chamber walls up to 300 °C.

Plug-compatible door module allows easy swap with standard 300 °C hot wall operation.

Stainless steel heater design with retained 6" aluminum chuck to achieve temperature uniformity of substrate.

All external temperature safety standards maintained with the option.

Pulsed CVD Option

Fully controlled through the system software for maximum flexibility of use in complex recipes. Two separately controlled MFC channels for CVD gases. Manifold valves support continuous flow

Glovebox Interface Option

Space in the glovebox: The access port for the swing-out door of GEMStar built into the back or side of the glovebox maximizes the usable workspace inside. No space is taken up in the middle of the glovebox by a large chamber.

Ease and Safety of Loading/Unloading: The substrate holder swinging out with the sidemounted door of GEMStar makes it easy and safe to load/unload substrates with minimal exposure to the chamber and minimal particle introduction.

Heat management: In GEMStar, most of the chamber heat is outside of the glove box, unlike vertical chambers which add significant heat load inside the glovebox which has to be actively managed.

Access to precursors and maintenance: GEMStar mounted on the back or side of a glovebox retains its easy, waist-high access forprecursor changeover and maintenance, unlike vertical chambers mounted under the glovebox with challenging access for maintenance.

Ozone Generator Option

Ozone is a stronger oxidizer than water and allows lower temperature ALD oxide depositions on temperature sensitive polymer substrates. With its higher reactivity, Ozone allows a broader range of precursor chemistries.

Ozone can also be used for in-situ cleans. Ozone is generated on-site from an O2 discharge, with continuous flow to the exhaust through an ozone destruct. The Ozone is connected to a process gas port on the back of GEMStar.

Ozone dose is controlled through an ALD valve on the oxidizer manifold with GEMFlowTM software.

Exhaust Abatement Option

The in-line furnace is typically operated at 700 °C which can break down most commonly used metalorganic precursors. It is capable of reaching temperatures up to 1100 °C.

The oxide or metal particles generated in the furnace are captured in a metal-mesh particle trap and prevented from reaching the pump.

Particle Coater Option

The GEMStar chamber size can accommodate up to 8” (200mm) diameter wafers, or 3D objects up to 1.3” (33mm) tall, or powders. Up to 300 °C hot-wall design with convective heating can achieve ±1C temperature uniformity in 3-dimensional space thus enabling conformal depositions over powders.

Exposure control is critical for conformal ALD films on high aspect ratio structures. Partial pressure and residence times are precisely controlled with a downstream vacuum valve.

Specially designed particle holder can be conveniently connected to GEMStar through the KF40 metrology port. Quick disconnect particle canister facilitates loading and unloading of particles. Customizable screen filter on particle canister. Seal-less magnetic drive for continuous rotation with user settable RPMs to facilitate conformal coatings around the particles.

Benchtop ALD Systems

Cost effective solutions that address the Atomic Layer Deposition (ALD) research community’s and low volume manufacturing’s current and future needs over a broad range of substrates and sample sizes.