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MicroWriter ML3 Mesa
Durham Magneto Optics
MicroWriter ML®3 Mesa is a compact, highperformance, direct-write optical lithography machine which is designed to offer unprecedented value for money in a small laboratory footprint. It also has an excellent environmental footprint: power consumption of the machine even when exposing is comparable to that of a laptop.Measuring only 70cm x 70cm at its base, the MicroWriter ML®3 Mesa sits on a standard laboratory bench or desk and plugs into a supplied laptop computer. Its only service requirement is a standard power socket. A light-excluding enclosure with safety interlock allows it to be used equally well in an open laboratory environment or in a clean room. Easy to use Windows® based software means most exposures can be set up and launched with just a few mouse clicks. Three different minimum feature sizes (0.6µm, 1µm, and 5µm) can be selected automatically via software. This allows non-critical parts of the exposure to be performed rapidly at 5µm minimum feature size while retaining high resolution writing for critical parts. The MicroWriter ML®3 Mesa also features an optical surface profilometer tool and an automated wafer inspection tool for examining fabricated structures.
Applications
• Microelectronics and semiconductors• Spintronics
• MEMS/NEMS
• Sensors
• Microfluidics and lab-on-a-chip
• Nanotechnology
• Materials science
• Graphene and other 2-dimensional materials
Features and Specifications
• 149mm x 149mm maximum writing area.• 195mm x 195mm maximum writing area available as an option.
• 155mm x 155mm x 7mm maximum wafer size.
• 230mm x 230mm x 15mm maximum wafer size available as an option.
• 0.6µm, 1µm, and 5µm minimum feature sizes across full writing area.
• Automatic selection of minimum feature size via software – no manual changing of lens required.
• 405nm long-life semiconductor light source, suitable for broadband, g- and h-line positive and negative photoresists (e.g. S1800, ECI-3000, MiR 701). Replacement 385 nm and 365nm lightsources available as option, suitable for g-, h-, and i-line photoresists (e.g. SU8). Dual wavelength option (405nm lightsource and 365nm lightsource, software selectable) available for best performance across g-, h-, and iline photoresists.
• XY interferometer with 15nm resolution for precise motion control.
• Extremely fast writing speed - up to: 15mm2/minute (0.6µm minimum feature size), 50mm2/minute (1µm minimum feature size), and 180mm2/minute (5µm minimum feature size). These allow a typical 50mm x 50mm area combining critical and noncritical areas to be exposed in under 30 minutes.
• Optical autofocus system using yellow light with real-time surface tracking module – no minimum wafer size.
• High quality infinite conjugate optical microscope with x3 aspheric objective lens, x10 Olympus plan achromatic objective lens, x20 Olympus plan apochromat objective lens, and yellow light illumination for alignment to lithographic markers on the wafer (±1.0µm 3? alignment accuracy).
• Automatic changing between microscope magnifications via software – no manual changing of lens required. Additional x4 digital zoom can be selected in software.
• Grey scale exposure mode for 3-dimensional patterning (up to 255 grey levels).
• Software API for external interfacing and control.
• 30nm minimum addressable grid. 15nm sample stage resolution.
• Acceptable file formats: CIF, GDS2, BMP, TIFF, JPEG, PNG, GIF; Oasis, DXF, Gerber RS-274X acceptable via KLayout conversion.
• Built-in 2-dimensional optical surface profiler (200nm thickness resolution) for examining exposed resists, deposited layers, etching and other MEMS process steps.
• Automatic wafer centring tool.
• Automatic wafer inspection tool allowing each die on a wafer to be imaged.
• Autocalibration tool allowing users to check and correct calibration.
• 2D barcodes can be automatically generated through software for exposures. The software can then identify the developed barcode patterns and reads the contents.
• Emailing multiple users when exposures are finished.
• Light-excluding enclosure with safety interlock.
• Easy to use, Windows® based control software supplied.
• Supplied with KLayout open-source mask design software (www.klayout.de).
• Supplied with pre-configured 64-bit Windows® 10/11 PC with monitor, keyboard, and mouse for ‘plug and play’ installation.
• Includes on-site installation by trained service technician.
• Extremely competitively priced for University and industrial R&D budgets.
• Can be later upgraded to MicroWriter ML® 3 Pro for higher performance.
• 90-260 VAC, 50-60Hz, 4A single phase power requirement.
• External dimensions: 70cm (w) x 70cm (d) x 75cm (h), excluding computer.
• CE-marked and compliant with EN-61010.
Options
• Replace 405nm lightsource with 385nm• Replace 405nm or 385nm lightsource with 365nm
• Clewin Software
• Virtual mask aligner
• Increases max samples thickness to 15mm)
• Increases max XY travel to 200mm - same as Pro)
• Temperature compensation module, same as Pro)
• 1 year's additional warranty
• Upgrade system to more advanced model
Examples of fabricated structures
